Monique Brumon

Examiner

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Details Monique Brumon Monique Brumon

: Semiconductor device manufacturing: process
: Packaging or treatment of packaged semiconductor
: Including adhesive bonding step

: Examiner
: active

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Thin interface layer to improve copper etch stop

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step

Reexamination Certificate

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Profile ID: LFUS-PAI-P-2818098

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