4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Ball or nail head type contact, lead, or bond

Michael Barry Pike

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Metallic interconnect pad, and integrated circuit structure usin

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Methods for monitoring components in the TiW etching bath...

Etching a substrate: processes – Nongaseous phase etching of substrate – With measuring – testing – or inspecting
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Michael Barry Pike does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Michael Barry Pike, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Michael Barry Pike will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-1248463

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure