4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Maya Shendon

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Backside gas quick dump apparatus for a semiconductor wafer proc

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field
Patent

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Plasma etching apparatus with conductive means for inhibiting ar

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
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Temperature control system for semiconductor process chamber

Coating apparatus – Gas or vapor deposition – Multizone chamber
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Profile ID: LFUS-PAI-P-294174

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