4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents

Masao Saika

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active

Non-rectangular thermo module wafer cooling device using the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Temperature control device

Heat exchange – Casing or tank enclosed conduit assembly – Conduit coiled within casing
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2634473

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