4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Masanori Shibamoto

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Method of manufacturing a ball grid array type semiconductor...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method of manufacturing a ball grid array type semiconductor...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Semiconductor device and its manufacturing method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Semiconductor device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2122162

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