4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package

Lynda Boutin

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active

Integrated circuit chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent

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Transfer molding method for forming integrated circuit package

Plastic and nonmetallic article shaping or treating: processes – With severing – removing material from preform mechanically,... – Flash or sprue removal type
Reexamination Certificate

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Profile ID: LFUS-PAI-P-526366

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