4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Ling-Chen Kung

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Electronic devices including offset conductive bumps

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Method for forming fine-pitched solder bumps

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
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Method for forming solder bumps of improved height and...

Metal fusion bonding – Process – Preplacing solid filler
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Method for forming solder bumps on flip chips and devices...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Method for forming wafer level package

Metal working – Method of mechanical manufacture – Electrical device making
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Profile ID: LFUS-PAI-P-2023433

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