4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Portion of housing of specific materials

Lewis Long

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active

Multi-surface mounting member and electronic device

Electrical connectors – With supporting means for coupling part
Reexamination Certificate

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Optical mirror module

Optical: systems and elements – Optical modulator – Light wave directional modulation
Reexamination Certificate

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Packaged microchip with isolation

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials
Reexamination Certificate

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Packaged microchip with premolded-type package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2691885

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