4. Measuring and testing
  5. Specimen stress or strain, or testing by stress or strain...
  6. Earth stresses

Lee J. Smith

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Method of making a semiconductor package including stacked...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Semiconductor package including stacked semiconductor dies...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Slope monitoring device

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – Earth stresses
Patent

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Profile ID: LFUS-PAI-P-1749945

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