4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Larry Lee Jordan

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Glass frit wafer bonding process and packages formed thereby

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
Reexamination Certificate

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Glass frit wafer bonding process and packages formed thereby

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Process for bonding micromachined wafers using solder

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Profile ID: LFUS-PAI-P-441153

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