4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Solder wettable contact, lead, or bond

Kuo-Liang Mao

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active

Bump structure with dopants

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Flip-chip bonding structure on substrate for flip-chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2493091

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