4. Chemistry: electrical and wave energy
  5. Apparatus
  6. Coating, forming or etching by sputtering

Kiyoshi Ooiwa

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Plasma process apparatus and plasma processing method

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent

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Plasma process apparatus and plasma processing method

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Plasma processing apparatus

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent

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Profile ID: LFUS-PAI-P-1430206

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