4. Fishing, trapping, and vermin destroying

Keiichi Tsujimoto

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Dual sided integrated circuit chip package with offset wire bond

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Lead frame and semiconductor device made using the lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Manufacturing dual sided wire bonded integrated circuit chip pac

Fishing – trapping – and vermin destroying
Patent

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Profile ID: LFUS-PAI-P-401322

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