4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified configuration

Kazuyuki Higashi

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Copper adhesion improvement device and method

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Drive circuit for voltage driven electronic element

Miscellaneous active electrical nonlinear devices – circuits – and – Signal converting – shaping – or generating – Current driver
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Drive circuit for voltage driven type semiconductor element

Miscellaneous active electrical nonlinear devices – circuits – and – Gating – Utilizing three or more electrode solid-state device
Reexamination Certificate

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Drive circuit of voltage driven element

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
Reexamination Certificate

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Fabrication method and wafer structure of semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
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Profile ID: LFUS-PAI-P-2013589

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