4. Coating processes
  5. Electrical product produced
  6. Integrated circuit, printed circuit, or circuit board

Katsumi Ogi

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Apparatus for preparing high melting point high toughness metals

Metallurgical apparatus – With means treating or handling gases exhausted by treating... – By condensing and collecting a volatile constituent
Patent

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Apparatus for preparing high-melting-point high-toughness metals

Metallurgical apparatus – With means treating or handling gases exhausted by treating... – By condensing and collecting a volatile constituent
Patent

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Apparatus for preparing high-melting-point high-toughness metals

Metallurgical apparatus – Means for treating ores or for extracting metals – By means applying heat to work – e.g. – furnace
Patent

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Ba and/or Sr titanate films by organic chemical vapor deposition

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
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Bi-based dielectric thin films, and compositions and method for

Compositions – Piezoelectric
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Profile ID: LFUS-PAI-P-55957

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