4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Kathuzi Komathu

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Method of molding a protective cover on a pin grid array

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent

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Pin grid array package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Profile ID: LFUS-PAI-P-1925778

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