4. Metal fusion bonding
  5. Process
  6. Using high frequency vibratory energy

Karl Osojnik

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Opto-electronic semiconductor component

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Patent

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Process for bonding semiconductor chips to substrates

Metal fusion bonding – Process – Using high frequency vibratory energy
Patent

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Profile ID: LFUS-PAI-P-1335614

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