4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Ju Hyun Lyu

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Thin stacked package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Thin stacked package and manufacturing method thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2826390

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