4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With dam or vent for encapsulant

Jose′ R. Diaz

Examiner

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Dam structure for center-bonded chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Heterojunction bipolar transistor, manufacturing method...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Bipolar transistor
Reexamination Certificate

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Semiconductor device, semiconductor integrated circuit, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Bipolar transistor structure – Including additional component in same – non-isolated structure
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2561919

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