Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2008-08-21
2009-06-30
Dang, Phuc T (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S119000, C438S124000, C438S126000, C438S127000, C257S782000, C257S783000, C257S784000, C257S787000
Reexamination Certificate
active
07553701
ABSTRACT:
The present invention relates to a semiconductor packaging method. The method comprises (S1) applying a die adhesive to an upper surface of a member through screen-printing; (S2) B-stage curing the member having the die adhesive; (S3) attaching a die on the B-stage cured die adhesive; (S4) wire-bonding the die to the member; and (S5) encapsulating the outside of the resultant, after the B-stage curing process of the step S2, a degree of cure of the die adhesive shows a decrease in heat capacity by 80 to 100%, and the step S3is performed such that the die adhesive maintains an adhesive strength of 10 kgf/cm2or more at normal temperature after the die attaching.
REFERENCES:
patent: 5208188 (1993-05-01), Newman
patent: 6621170 (2003-09-01), Yamamoto et al.
patent: 2002/0050585 (2002-05-01), Masayuki et al.
patent: 2008/0241452 (2008-10-01), Kondo et al.
Hyun Soon-Young
Kang Byoung-Un
Kim Jae-Hoon
Kim Ji-Eun
Kim Ju-Hyuk
Dang Phuc T
Jones Day
LS Mitron Ltd.
Tran Thanh Y
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