4. Metal fusion bonding
  5. Process
  6. With measuring, testing, indicating, inspecting, or...

John Joseph Garrity

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Enhanced pad design for substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Enhanced pad design for substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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Enhanced pad design for substrate

Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-2023681

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