4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

John F. McCormack

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Interconnection method entailing protuberances formed by...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Module with bumps for connection and support

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2599368

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