4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

John D. LaBarre

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Removal of substrate perimeter material

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Simplified high Q inductor substrate

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Self-aligned
Reexamination Certificate

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Simplified high Q inductor substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1704259

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