4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Jie-Hung Chiou

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Chip package structure and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Method of fabricating chip package structure

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3280378

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