4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Jens Nave

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active

Core metal soldering knob flip-chip technology

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Patent

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Process and device for forming raised metallised contacts

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Profile ID: LFUS-PAI-P-1475987

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