Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
Inventor
active
Contact with germanium layer
Germanium alloy contact to a silicon substrate
Germanium alloy electrical interconnect structure
Method of forming a contact
Method of VLSI contact, trench, and via filling using a...
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Profile ID: LFUS-PAI-P-827513