4. Static information storage and retrieval
  5. Read/write circuit
  6. Having fuse element

Jay S. Parks

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Microelectronic die including low RC under-layer interconnects

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Microelectronic die including low RC under-layer interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Programming and evaluating through PMOS injection

Static information storage and retrieval – Read/write circuit – Having fuse element
Reexamination Certificate

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Programming and evaluating through PMOS injection

Static information storage and retrieval – Read/write circuit – Having fuse element
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Programming and evaluating through PMOS injection

Static information storage and retrieval – Read/write circuit – Having fuse element
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-2387668

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