4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Responsive to non-electrical signal
  6. Electromagnetic or particle radiation

James Seng-Ju Ni

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Circuit trimming of packaged IC chip

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Intergrated circuit chip package with reduced parameter offsets

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2761336

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