4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

James George Lance, Jr.

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Flip underfill injection technique

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Process for fabricating a solder bump for a flip chip integrated

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Profile ID: LFUS-PAI-P-363086

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