4. Metal fusion bonding
  5. Process
  6. Using high frequency vibratory energy

Izuru Komatsu

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Method of joining metallic members, and joined metallic members

Metal fusion bonding – Process – With pretreating other than heating or cooling of work part...
Reexamination Certificate

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Mounting material, semiconductor device and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Optical semiconductor device and method of manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...
Reexamination Certificate

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Solder material and method of manufacturing solder material

Metal fusion bonding – Solder form
Reexamination Certificate

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Solder material and method of manufacturing solder material

Metal fusion bonding – Process – Using only pressure
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Profile ID: LFUS-PAI-P-1840863

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