4. Spring devices
  5. Resilient shock or vibration absorber
  6. Including energy absorbing means or feature

Isao Ozawa

Inventor

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Details

Inventor

active

Chip mounting substrate, first level assembly, and second...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Cup dispenser

Article dispensing – With discharge assistant – Follower
Patent

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Elastically damping device for suspension of engine

Spring devices – Resilient shock or vibration absorber – Including energy absorbing means or feature
Patent

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Elastically damping device for the suspension of an engine

Spring devices – Resilient shock or vibration absorber – Including energy absorbing means or feature
Patent

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Fluid-filled damper device

Spring devices – Resilient shock or vibration absorber – Including energy absorbing means or feature
Patent

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Profile ID: LFUS-PAI-P-231851

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