4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Hyung Ju Lee

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Apparatus for manufacturing semiconductor packages

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Reexamination Certificate

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Lead frame for semiconductor package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Lead frame for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Lead frame for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Leadframe for semiconductor package and mold for molding the...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2298057

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