4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Configuration or pattern of bonds

Hsueh-Chung Shelton Lu

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Flip-chip bump arrangement for decreasing impedance

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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System and method for coordinated inter-organizational...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate

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