4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Hsu-Tien Hu

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Method for forming solder bumps of improved height and...

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Method for forming solder bumps on flip chips and devices...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Wafer level package incorporating elastomeric pads in dummy...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2023434

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