4. Electric heating
  5. Metal heating
  6. By arc

Hisayuki Tsuruta

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Apparatus for marking semiconductor devices

Electric heating – Metal heating – By arc
Patent

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Mold assembly for encapsulating semiconductor device

Plastic article or earthenware shaping or treating: apparatus – With interposed non-adhering web or sheet type parting means
Reexamination Certificate

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Molding die for concurrently molding semiconductor chips...

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Female mold type means
Reexamination Certificate

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Plural semiconductor devices bonded onto one face of a...

Plastic and nonmetallic article shaping or treating: processes – Direct application of fluid pressure differential to... – Producing multilayer work or article
Reexamination Certificate

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Process for concurrently molding semiconductor chips without...

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Female mold type means
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1980309

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