4. Metal fusion bonding
  5. With means to cool work or product

Hideki Mukuno

Inventor

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Bump forming method and bump forming apparatus

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Electron device and semiconductor device

Alloys or metallic compositions – Tin base – Copper containing
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Electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Soldering machine

Metal fusion bonding – With means to cool work or product
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Soldering machine

Metal fusion bonding – Including means to apply flux or filler to work or applicator – Gaseous flux
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Profile ID: LFUS-PAI-P-2484844

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