4. Metal fusion bonding
  5. Process
  6. Diffusion type

Helmut Seidl

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Device for transporting and positioning semiconductor wafer-type

Cleaning and liquid contact with solids – Processes – Longitudinally traveling work of bar – strip – strand – sheet...
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Lancet device for puncturing the skin

Surgery – Instruments – Cutting – puncturing or piercing
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Method for diffusion welding under isostatic pressure

Metal fusion bonding – Process – Diffusion type
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Profile ID: LFUS-PAI-P-1076771

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