4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Harry Kam Cheng Hong

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Leadless leadframe package design that provides a greater...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Leadless leadframe package design that provides a greater...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Leadless leadframe package design that provides a greater...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Locking of mold compound to conductive substrate panels

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Locking of mold compound to conductive substrate panels

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-2458224

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