4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Hans-Georg Wissmeier

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Circuit-board overlaid with a copper material on both sides or i

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Circuit-board overlaid with a copper material on both sides or i

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Profile ID: LFUS-PAI-P-192818

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