4. Static information storage and retrieval
  5. Interconnection arrangements
  6. Optical

Gwang-Man Lim

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active

Interposer and stacked chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Memory module having high data processing rate

Static information storage and retrieval – Interconnection arrangements – Optical
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2207940

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