4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Gary Eugene Oberlin

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Flip chip with backside electrical contact and assembly and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Frontal impact characterization apparatus for a motor...

Communications: electrical – Land vehicle alarms or indicators – Of collision or contact with external object
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2108869

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