4. Fishing, trapping, and vermin destroying

Gaetan Mathieu

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Compliant semiconductor chip assemblies and methods of making sa

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Compliant semiconductor chip assemblies and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Connection components with frangible leads and bus

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Connection components with frangible leads and bus

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Electronic component overlapping dice of unsingulated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-567445

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