4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Incorporating resilient component

Ford Grigg

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Direct die contact (DDC) semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Direct die contact (DDC) semiconductor package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
Patent

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Method for fabricating solder bumps by wave soldering

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Process for fabricating external contacts on semiconductor...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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System for fabricating solder bumps on semiconductor components

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Reexamination Certificate

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Profile ID: LFUS-PAI-P-809290

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