4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Edward Schrock

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BGA package having substrate with patterned solder mask...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Composite interposer for BGA packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Composite interposer for BGA packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Method for fabricating BGA package using substrate with patterne

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Method of making a flexible substrate with a filler material

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1290263

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