4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead

Edmund David Blackshear

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Nickel alloy films for reduced intermetallic formation in solder

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Patent

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Nickel alloy films for reduced intermetallic formation in...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Stress accommodation in electronic device interconnect...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1924549

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