4. Semiconductor device manufacturing: process
  5. Formation of electrically isolated lateral semiconductive...
  6. Total dielectric isolation

Douglas A. Knapp

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Glass frit wafer bonding process and packages formed thereby

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
Reexamination Certificate

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Glass frit wafer bonding process and packages formed thereby

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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