4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Donald J. Esses

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Corrosion sensitivity structures for vias and contact holes in i

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Corrosion sensitivity structures for vias and contact holes...

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate

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Reticle based skew lots

Semiconductor device manufacturing: process – Masking
Patent

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Profile ID: LFUS-PAI-P-1792357

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