4. Semiconductor device manufacturing: process
  5. Coating of substrate containing semiconductor region or of...
  6. Insulative material deposited upon semiconductive substrate

Denis H. Endisch

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Contact planarization using nanoporous silica materials

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Contact planarization using nanoporous silica materials

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Edge bead removal for nanoporous dielectric silica coatings

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Patent

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Edge bead removal for spin-on materials containing low...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Edge bead removal for spin-on materials containing low...

Coating processes – Centrifugal force utilized
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1816912

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