4. Active solid-state devices (e.g., transistors, solid-state diode
  5. With means to control surface effects
  6. Insulating coating

David Matsumoto

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Planarization method using hybrid oxide and polysilicon CMP

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Planarization method using hybrid oxide and polysilicon CMP

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Reduction of silicon oxynitride film delamination in integrated

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Patent

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Thin film germanium diode with low reverse breakdown

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-700955

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