Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
Inventor
active
Disposable sensor for use in measuring an analyte in a...
Electrical devices
Fluorescence standard for use in microfluidic instruments
Isolated flip chip of BGA to minimize interconnect stress...
Isolated flip chip or BGA to minimize interconnect stress...
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Profile ID: LFUS-PAI-P-246931